Daisy Chain QFN components with dummy silicon die are for use in a variety of SMT process and thermal profile testing applications.

Bottom terminal QFN packages feature 100 pins, spaced at 0.4mm. Are 12 x 12mm. Package size conforms to JEDEC standards with package height not exceeding 1mm. Terminals and ground pads are plated with Ni Pd Au. Package-level Daisy Chain circuit, made with 25µm gold bonding wire, forms an electrical connection between pads. Zero-ohm connections may be used to monitor electrical opens and shorts to determine cause of PCB failure with GO/No-Go techniques using an ohm meter. Operating temperature range is -65⁰C to +150⁰C.

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