PF606-P245 lead-free zero halogen solder paste has continuous high-speed printability and a wide reflow process window.

Reportedly prevents head-on-pillow issues, produces low void and fits complicated PCB designs. Improves ICT testability with flux removed from top of solder to prevent contamination of test pins during test operation. Minimal flux residue gathers near outside of solder joint on PCB substrate.

Shenmao America
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