UA-3307-B is an edgebond adhesive that enhances board level reliability in automotive and other harsh environment applications. 

BGAs whose corners and edges are bonded with this adhesive reportedly have passed more than 2000 cycles of -40°C to 125°C thermal cycling without failure. Large WLPs exceeding 8mm have passed more than 1500 cycles.  Has Tg of 149°C and CTE of 15 ppm/°C. Board preheat and dwell time are not needed for underfill flow; no underfill voids caused by flux residues impeding flow. No underfill/flux residue chemical incompatibility affecting underfill cure.

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