KY8030-3 SPI now includes integrated automated solder paste dispensing.

User-friendly dispenser can be used to repair insufficient solder conditions or weak joints. Potentially eliminates board scrap or cleaning, and enhances first-pass yield. Auto Repair system design extends service and cleaning interval to up to seven days. Syringe holder incorporates one-touch release for easy and quick replacement. Provides 2D and 3D images of pads before and after dispensing.

Koh Young Technology

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