EP42HT-3AO two-component, moderate viscosity epoxy system has good flow properties.

Is for small to moderate size encapsulating, potting and casting applications. Is also effective in bonding fragile components requiring a low coefficient of thermal expansion. Is designed to optimize heat dissipation properties, and improve quality and reliability of electronic devices subjected to thermo-mechanical stresses. CTE of 13-16x10^-6 in/in/°C and glass transition temperature (Tg) of 140-150°C. Thermal conductivity of 11-12 BTU•in/ft²•hr•°F [1.59-1.73 W/(m•K)]. Exhibits low shrinkage upon curing, dimensional stability, and structural strength. Volume resistivity of >1014 ohm-cm. Serviceable from -100° to +400°F. 100% reactive epoxy formulation has a non-critical 100:40 mix ratio by weight and a working life of 60-90 min. after mixing for a 100g batch at 75°F. Recommended cure schedule of overnight at room temperature, followed by 2-3 hr. at 150°-200°F. Comes in ounce, ½ pint, pint, quart and gallon kit containers. Specialty packaging permits automated dispensing.

Master Bond

www.masterbond.com/applications/potting-and-encapsulation