Type AuR gold ribbon bonding wire is fabricated to 4N specifications with 99.99% purity using a dry process.
Sizes range from 12.7µm to 50µm thickness. Widths range from 25µm to 250µm. Is typically packaged on 2" high-purity ribbon spools with lengths up to 100m. Is produced using a rolled process with stress relief. Edges are smooth. Is reportedly ideal for RF devices, high-reliability applications and high-power applications such as laser and microwave devices.
Tanaka Precious Metals
pro.tanaka.co.jp/en
Register now for PCB WEST, the leading trade show for the printed circuit design and electronics manufacturing industry! Coming Sept. 11-13 to the Santa Clara Convention Center.