SMF-UL51 no-clean, halogen-free, ultra-low-residue spray flux is designed for copper pillar bonding.

Reportedly provides superior spraying uniformity. Features outstanding soldering performance.       

Shenmao
www.shenmao.com

 

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account