Low-void solder columns have high temperature core and are structurally stronger and more reliable than ones with a higher incidence of voids.

Are reportedly 10 times more reliable that solder balls when attaching large-size ceramic IC packages to FR-4 or polyimide PCBs operating in harsh environments. Are compliant and absorb CTE mismatch, thereby lengthening the life of the circuit. Exceed requirements of Mil-STD-883K. Come in a range of solder columns. Typical solder core materials include Pb90Sn10 and Pb80Sn20.

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