Master Bond EP17HTND-CCM is a single-component epoxy that is not premixed and frozen.

This black, heat-curable compound has a flowable paste consistency ideal for glob top, chip coating and bonding applications. Meets NASA low outgassing specifications and is serviceable from -80°F to +600°F. Forms high strength bonds to substrates such as metals, ceramics, plastics, composites and various PCB materials. Is thermally conductive and electrically non-conductive with exposure to hostile environmental conditions. Has high-volume resistivity of more than 10¹⁵ ohm-cm at 75°F and over 10¹² ohm-cm at 400°F. Thermal conductivity is 9-10 BTU•in/ft²•hr•°F [1.4423 W/(m•K)] at 75°F. Resists chemicals such as acids, bases, salts, fuels, oils and many solvents. Cures in 1-2 hr. at 350°F, with relatively low exotherm upon curing. Dispensable from a syringe, either manually or automatically. Is available in common size syringes ranging from 10cc to 30cc.

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