Master Bond EP3UF-1 single-component epoxy is not premixed and frozen.

Has viscosity of 5,000-15,000cps. Heat-curable thixotropic compound is reportedly ideal for underfill and many bonding applications. Delivers compressive strength of 18,000-20,000psi and tensile modulus of 450,000-500,000psi. Has thermal conductivity of 9-10 BTU•in/ft²•hr•°F [1.30-1.44 W/(m•K)]. Contains filler with small particle size. Can be applied in bond lines as thin as 10-15µm, imparting thermal resistance of 5-7 x 10-6 K•m²/W. Has Dk of 4.5 at 60Hz and dielectric strength of 450V/mil (for 1/8" thick test specimen), both measured at 75°F. Reportedly has unlimited working life at room temperature and cures in 20-30 min. at 250°F or in 10-15 min. at 300°F.

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