TM-6520 low-temperature cure adhesive is designed for die attach and general PCB assembly applications. Is electrically insulating.

Cures in 60 min. at 70°C or 20 min. at 100°C with a thermal conductivity of 1.7 W/°K. Has 24-hr. work-life and a 15,000cP viscosity at 5rpm. Developed to pass reliability requirements in die attach, disk drive, camera module, photonics and PCB assembly applications.

Engineered Material Systems
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