YSP10 solder paste printer has an automatic changeover system.

Includes print stability control systems, automatic support pin exchange, automatic stencil replacement and automatic solder paste transfer functions. Can remove solder paste from existing stencil and transfer it to another in about 1 min. with zero operator interaction. Overall process cycle time (including stencil cleaning) reportedly has been improved 20%. Other enhancements include compatibility with a wider range of PCB sizes and a reduction in cleaning paper consumption volume with redesigned stencil wiper system. Reduces changeover time to 2 min. (under optimal conditions).

Yamaha Motor Intelligent Machinery
yamaha-motor-im.com/en/