TF Series BGA rework systems include TF1800, designed for standard board sizes of up to 12" x 12", and TF2800 for large, high-mass PCBs up to 24" x 24".

Both incorporate topside inductive-convection heater that provides rapid heat-up and active cooling of solder joint; allows for active cooling feature, providing controlled cool-down directly through nozzle. Automated reflow head is driven by stepper motor that reportedly provides smooth, high-precision, repeatable movement, with no drift, allowing for soft landing of components and 30µm (0.0012") placement accuracy. Vacuum pick/shaft design is counterweight balanced to eliminate placement pressure on components; uses high-temperature, linear ball bearings. Has adjustable-height bottom-side IR preheater. Other features include HD vision overlay system for optical alignment with quad-field imaging capability for alignment of outsized BGAs or large fine-pitch QFPs, integrated underside board support, and software that guides operators through intuitive interface.

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