Sherlock Automated Design Analysis software v. 6.1 has locked IP models and thermal mechanical BGA life predictions.

Provides more powerful predictive capabilities and ability to protect design advantages across supply chain. Designs can travel between suppliers and OEMs and preserve design details without disclosing intended use, environmental conditions, or reliability requirements. Can predict reliable lifetime of BGAs based on actual conditions. Can model how system-level effects, such as mirroring and the application of underfill materials, impact life of components. Thermal mechanical analysis gives engineers power to pick best components for packages before physical testing. Meshed parts may be used with subassemblies to create and analyze multi-card chassis models. ICT analysis module provides life predictions based on user-provided strain rate. Library now contains more than 80,000 combinations of laminated glass styles.

DfR Solutions
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