LED405Med one-component, LED-curing adhesive meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly.

Does not need UV light for curing. Nanosilica filler results in lower shrinkage upon cure and greater dimensional stability, with a CTE of 35-40 in/in x 10-6/°C. Cures to a hardness of 65-75 Shore D. Is optically clear, with a refractive index of 1.50. Is said to have excellent light transmission properties. Electrically insulative system features volume resistivity of more than 10¹⁴ ohm-cm and a Dk of 4.2 at 60Hz. Viscosity of 2,000-8,000 cps. For use in bonding, sealing and coating. Cures up to 0.125" thick and is suitable for small encapsulations involving optical assemblies or other sensitive components.

No-mix system cures fully tack-free upon exposure to a 405nm wavelength light source without any oxygen inhibition. In thinner sections, full cures can be achieved in 30-45 sec. Is serviceable from -60° to +250°

Master Bond

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