S3X58-HF1000 halogen-free solder paste has stabilizers to inhibit oxidation-reduction reaction at room temp.

Activator in flux is designed to be highly heat resistant. Flux exerts fullest activation strength at reflow temperature for robust solder wetting. Exhibits good solder spreading and wetting performance, regardless of type and condition of metal finish. Stable print shape and paste transfer ratio are observed at 0.25mmΦ CSP and 0.4mm QFP. Maintains paste transfer rate when printing is resumed after being left idle for 60 min. Retains ample activation strength at high temp. and exhibits high head-on-pillow resistance.

Koki Co. Ltd.
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