Seho PlasmaFluxer uses cold-active plasma to melt micrometer-sized powder of adipic acid and deposit it on PCB.

Liquid carrier material is reportedly not needed. Nitrogen is used to create plasma flame. Aerosol formed from meltable flux particles and Nitrogen is led into plasma flame and directed to PCB surface. Once aerosols touch surface, particles solidify and form long-term coating. Substitutes wet-chemical flux activation with dry process. Soldering results are reportedly comparable to standard liquid fluxes.

Seho
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