Bergquist Liqui-Form TLF 6000HG is a thermally conductive, dispensable, pre-cured gel that offers stable viscosity in storage and use.

Can accommodate gaps up to 3mm. Pre-cured formulation requires no mixing or refrigeration. Applied, 6 W/m-K TIM gel maintains form and position. Addresses high thermal conductivity requirements of 5G telecom infrastructure systems. Aligns with large-scale manufacturing protocols, delivering compliance with UL and RoHS industry standards. Shows excellent vertical gap stability, with no slipping during more than 1,000 hr. of gap stability testing. Passes more than 1,000 hr. of thermal cycling testing without any material cracking or degradation in thermal conductivity.

Henkel
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