Palomar 8100 automated, thermosonic high-speed ball-and-stitch wire bonder performs ball bumping and customized looping profiles.

Built on Palomar 8000 platform, with latest technology in motion control, software and user experience. Features Vision Standardization software. Is for applications with tight spaces, fragile surfaces, flip-chip, deep access cavities and provides excellent material flexibility. Typical applications include large complex hybrids; HB/HP LED arrays; optoelectronic packaging; chip-on-board; system in packages; specialty lead frames; automotive assemblies; flex circuits; multi-chip modules; fine-pitch devices; and LEDs with running stitch. Uses VisionPilot pattern referencing software for vision processing. Provides traceability of bond parameters and overview of processes and performance. Includes wire-feed path for faster loading and full view of wire during operation; all user interaction points within operator reach; adjustable, articulating monitors and keyboard. Microscope is available while bonder is in operation. Has graphical real-time displays of operations and gauges in one location and rapid response by employing color-coded error signals.

Palomar Technologies
palomartechnologies.com

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