Viscom X7056-II BO inspects bond wires optically and radiographically in an inline system that reportedly ensures inspection of power semiconductors and encapsulated sensor elements.

Combines optical wire bond control with x-ray inspection to inspect wire bonds, including enclosed ones, and concealed solder joints beneath chips. Inspects tapes and wires, and soldering quality of dies. High-res sensor technology covers all bond points and wires, as well as open and concealed connection points, so quality of wire runs, dies and component layers, damage and position deviations, as well as voids in surface soldering can be detected. Standard library contains relevant inspection patterns for die bonds, ball-wedge, wedge-wedge and security bonds. For final assembly for power electronics, circuits, sensor construction and packaging.

Viscom
viscom.com