ER6006 and ER7006 Bio epoxy resins provide good flow characteristics to allow potting of difficult and complex geometries. ER6006 is two-part high thermally conductive epoxy encapsulation resin primarily developed for encapsulation of LED driver units.

Offers high chemical resistance and excellent protection in a range of environments. Reportedly provides exceptional adhesion to range of substrates and helps extend electronics life with quick heat dissipation (2.65W/mk). Cures within an hr. at 100°C, 3 hr. at 60°C or 24 hr. at room temp. Is a two-part unfilled viscous epoxy resin ideal for UPS: connector, CCTV camera cable gland sealing, wiring harness adhesive, encapsulation, bonding and potting of electrical components. Has 1:1 ratio. Resistant to aqueous alkaline, acid and saline solutions. Provides op. temp. range of -40° to +150°C.

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