EP4EN-80 is a NASA low outgassing approved epoxy that cures at temperatures as low as 80°C.

Features quick cure profile at 65°C for 90 min. plus 30 min. at 80°-85°C. Requires no mixing prior to use, has a viscosity of 600-1,800 cps and contains no solvents. Free flowing, it is suitable for bonding and small potting and encapsulations up to about 0.25" thick in some applications. Ultra-fine particle size filler material offers unique gap filling and heat transfer capabilities. Thermal conductivity value is 0.75-0.85 W/(m•K), and volume resistivity is more than 1014 ohm-cm at room temperature. When used as an adhesive, EP4EN-80 can be applied in thicknesses as thin as 10-15 microns. Compressive strength of 24,000-26,000 psi and tensile modulus of 1,200,000-1,400,000 psi at room temperature. Is serviceable over the temperature range of -50° to +150°C. Bonds well to a variety of substrates such as metals, composites, ceramics and many plastics. RoHS compliant. Comes in ½ pint, pint, quart and gallon sizes.

Master Bond

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