iX7059 heavy duty inline automated inspection x-ray system has a newly developed transport system that handles workpiece carriers and soldering frames.

Transport assemblies with dimensions up to 500 x 500mm and weight up to 40kg. Can be deployed for 2-D, 2.5-D, and 3-D analyses. Resolution extends from 8μm to more than 30μm, depending on configuration. Complex inspection objects are irradiated with 130kV or 160kV (optional). Broad inspection scope extends to soldering defects, damage, twisted, missing, or incorrect components, as well as concealed voids, blow holes/voids in surface solder joints and degree of filling of PTH solder joints. Combined with computed tomography, shows defects in sectional images in detail. Reportedly simplifies verification, reduces false alarms, eliminates reworking and prevents product waste. Includes touchscreen monitor and setup via vVision or EasyPro operating software.

Viscom
viscom.com

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