SMT 158N is a non-flow, low-temp., slow-cure, high-purity liquid epoxy underfill and capillary underfill encapsulant.

Has high viscosity and can be used as dam material, corner bond, edge bond or encapsulant. Can withstand temp. down to -273°C. Can be used for flip-chip, wafer-level chip scale package applications. Also suitable for bare chip protection in advanced packages such as memory cards, chip carriers, hybrid circuits and multichip modules.

Yincae Advanced Materials
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