Structalit 5511, 5521 and 5531 one-component epoxy adhesives cure at low temp. Adhere well to substrates with low surface energy.

Cure at 60°C; suitable for temp.-sensitive electronic components. Curing at higher temp. accelerates cure time and adds additional strength to bond. Generate high bond strength with materials typically used in electronics. Can also adhere well to liquid crystal polymer and other high-tech plastics with low surface energy. Possess high purity and low ion content; comply with international standards for electronic and microelectronic component assembly. Structalit 5511 features low ionic content and is suitable for use in electronics. Combines high Young's modulus with elongation at break of more than 8%; ensures high adhesion to many substrates with additional shock and vibration resistance. Structalit 5521 is softer and more flexible after curing. Has low modulus of elasticity; is suited for potting or application of thicker adhesive layers. Structalit 5531 has low coefficient of thermal expansion, yet is flexible enough to withstand drop and vibration tests. Incorporation of filler particles gives it high resistance to mechanical and chemical influences.

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