i-Cube10 (YRH10) hybrid placer has surface mounter functions for electronic components and a die bonder for wafer components.

Developed as successor to i-CubeIID (YHP-2D). Achieves bare chip mounting speed of 10,800 CPH from wafer supply and mounting accuracy of ±15μm. Features include high-speed productivity by optimizing recognition camera operations for mounting head and wafers; component recognition via head-mounted scan camera; 10-unit multi-nozzle mounting head; accelerated wafer swaps; high-rigidity conveyor; axis control optimization; and heat compensation feature. Mounts surface mount devices and wafer components. Has wafer pickup condition setup utility that can optically set conditions for wafer parts. Feeder unit capacity is twice that of previous models. Operation of mounting head and wafer camera eliminates standby time loss of mutual units. Has 10 nozzles on mounting head. Wafer replacement time has been shortened. Uses recognition system for ball/bump components. High-rigidity conveyor reduces dynamic vibration. Mounting accuracy is ±15μm (μ+3σ). Compatible with PCBs up to 330 mm x 250mm. Has automatic tool replacement and dual push-up unit. Is compatible with auto-loading feeder; can supply tape reel components without stopping production.

Yamaha Robotics SMT Section
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