LED405FL3 is a one-component LED curing adhesive with optical clarity and a refractive index of 1.51.

Flexibility permits stress minimization when bonding substrates with different coefficients of thermal expansion. Uses fluorescent dye for detection purposes. No-mix system cures tack-free on exposure to 405nm wavelength light source without oxygen inhibition. In thinner sections, full cures can be achieved in 30-45 sec. Rate of cure depends on intensity of light source, thickness of adhesive layer and distance from light to adhesive. Is serviceable from -100° to +250°F. Cures with hardness of 5-15 Shore D at room temp. Performance properties include electrical insulation and resistance to thermal cycling, shock and vibration. May be used for small potting and encapsulation applications. Solvent-free and RoHS-compliant.

Master Bond
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