VT-S10 series 3D AOI uses multi-direction, multi-color imaging, MPS 3D hardware and AI to reduce false calls, improve first-pass yields and optimize defect detection.

Combines advanced illumination, sophisticated image processing and full 3D measurement data to yield high-quality solder inspection. Shadow and secondary reflection impacts common to 3D AOI reportedly have been eliminated through new hardware developments like quad, multi-phase shift projectors that allow for stable inspection across PCBA. Designed with 5-Zero philosophy: zero PCB design constraints; zero false calls and escapes; zero operation and programming; zero downtime; zero defects.

Omron Automation Americas
automation.omron.com