Bonding system is designed to bond replacement circuit patterns such as surface mount pads, BGA pads, and plated hole pads to PCBs.

Uses bonding tips to deliver calibrated pressure to activate and cure dry-film adhesive applied to replacement circuit patterns. Has built-in calibration gauge to maintain regulated bonding force and adjustable temp. control to maintain uniform temp. throughout 30-sec. replacement circuit bonding cycle. Is available with optional stereo zoom microscope.

Circuit Technology Center
circuitmedic.com