WS-3910 liquid flux is designed to meet process needs for low-temperature flip-chip applications.

Is water-soluble and halogen-free. Designed for low-temp. (150°C) bismuth-tin applications. Is chemically designed to exhibit minimal evaporation after application. Reportedly eliminates compatibility underfills by having water-cleanable residue. Features low evaporation after application; does not dry out during reflow; shows strong activity at low temp., with current peak reflow temp. of 150°C.

Indium Corp.
indium.com

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