Alpha OM-565 HRL3 high-reliability low-temp. solder paste is formulated for assemblies to mitigate warpage-induced defects in temperature-sensitive chip-scale packages.

Is designed to enable target reflow temp. of 175°C with superior wettability to minimize post-reflow defects such as non-wet-open and head-in-pillow. Reportedly offers superior thermomechanical and drop shock performance. Provides excellent compatibility in contact rework applications with Alpha-tested cored wire and rework fluxes. Is also available in solid solder formats, including bar solder and wire for selective and dip soldering processes.

MacDermid Alpha
macdermidalpha.com

ALPHA OM 565 HRL3 Solder Paste 10MAR22

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