Alpha OM-565 HRL3 high-reliability low-temp. solder paste is formulated for assemblies to mitigate warpage-induced defects in temperature-sensitive chip-scale packages.

Is designed to enable target reflow temp. of 175°C with superior wettability to minimize post-reflow defects such as non-wet-open and head-in-pillow. Reportedly offers superior thermomechanical and drop shock performance. Provides excellent compatibility in contact rework applications with Alpha-tested cored wire and rework fluxes. Is also available in solid solder formats, including bar solder and wire for selective and dip soldering processes.

MacDermid Alpha
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