PF735-PQ10-10 low-melting-point lead-free solder paste is capable of reducing reflow temp. to below 190°C, decreasing PCB and substrate deformation.

Reportedly saves energy and reduces thermal stability requirements of PCBs and components. Ideal for SMT devices with sensitive components. Offers excellent ductility, microstructure, and drop and thermal reliability. Is halogen-free. Complies with RoHS, RoHS 2.0 and REACH.

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