1911MK5-VR Nitrogen Vacuum Reflow Oven has 11 zones, a vacuum chamber, closed-loop nitrogen atmosphere control and Cool-Pipe flux management system, which traps flux so it can be removed and replaced while oven is running.

Targets voiding ratios of less than 2% and cycle times of 40 sec. for single-lane implementation and 20 sec. for dual-lane systems. Maintains solder paste reflow specification, including liquidous times of under 60 sec. Is suitable for high-temp. applications up to 450°C. Has In-Zone IR heating.

Heller Industries
hellerindustries.com