AOX755 flux-filled high-performance solder wires are based on two soft solder alloys filled with three cores of flux compound EO-FC-006.

Developed for processing in solder wires to optimize soldering behavior and smoke and residue behavior. Both wires were tested on Eutect equipment. Soft solder developed for electronics sector, which consists of tin, copper, nickel and germanium. Micro-alloyed solder reduces copper leaching and has oxidation-inhibiting effect. Second alloy Sn96.5Ag3Cu0.5 (SAC 305) is standard soft solder consisting of tin, silver and copper. Halogenide-free high-performance filler was developed as flux filling to produce Pb-free soft solders.

Emil Otto
emilotto.de