Structalit 5705 removable edge bonder is formulated for bonding consumer electronics components.

Black adhesive fluoresces yellow when using UV light, which reportedly enhances accuracy of inline optical inspection systems. Thermosetting epoxy resin adhesive is characterized by viscous flow properties and high thixotropy index. Can be dispensed using pneumatic valves or through contactless jet dispense systems. Is low in halogens. Is selectively reworkable when cured adhesive receives thermal exposure above its glass transition temp. (Tg) of 150°C. Softens and can be manually scraped away using small spatula or similar instrument. Below this temp., it protects bonded components. Can be used in conjunction with reworkable underfill Structalit 5751. Both adhesives can be applied wet-on-wet and cured together in one oven process step.

Panacol
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