NC-809 halogen-free, ultra-low residue, flip-chip flux is designed to hold die or solder spheres in place without risk of die shift during assembly.

Reportedly leaves minimal residue after reflow and exhibits superior wetting performance. Is qualified for ball grid array ball-attach applications for packages sensitive to traditional water cleaning processes. Offers high tackiness to eliminate die tilting or shifting during reflow; consistent flux deposition and excellent wetting; compatibility with variety of underfills; reduced warpage of package and lower thermal stress.

Indium Corp.
indium.com