SMEF-Z52 enhanced solder joint encapsulation material flux combines abilities of conventional flux and underfill.

Epoxy cures after reflow and provides excellent bonding strength and joint protection. Is active epoxy flux designed for SMT assembly (SAC paste) and BGA ball mount (SAC ball) processes. Activator helps eliminate solder balls and form smooth solder joints. Epoxy flux residue is cured and provides mechanical support to joint after reflow. Reportedly doesn’t require cleaning and has excellent compatibility with molded underfill and capillary underfill. Is suitable for system-in-package (SIP), wafer-level-package (WLP) and flip chip. Is halogen-free and complies with RoHS, RoHS 2.0 and REACH. Is designed for use in stencil printing, dispensing, jetting, dipping and pin-transfer processes.

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