PF918-PW216 solder paste adopts the newly designed high-reliability lead-free alloy (Sn/4Ag/3Bi) with tensile strength performance 1.4 times higher than typical SAC 305 alloys.

Water-cleanable, with thermal cycling reliability performance suitable for automotive devices and high-power components with high thermal reliability requirements. Thermal cycling life is twice as long as SAC 305 under board-level thermal cycling tests with a real automotive IC product. Is halogen-free (ORH0) and complies with RoHS, RoHS 2.0 and REACH. Excellent voiding performance. Similar melting point to SAC 305 so the regular SAC 305 reflow profile can be applied. Is designed for consumer electronics, servers, automotive electronics and long service life electronic products with high reliability requirements.

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