PF735-EP307 joint enhanced solder paste (JEP) is a low-melting-point epoxy-based solder material for extremely fine-pitch or fine-pad soldering, especially advanced display assembly.

Has advantages of conventional solder paste and anisotropic conductive paste; i.e., self-alignment and planar insulation, respectively. Epoxy is cured after reflow and provides bonding strength and joint protection. Reliability performance is enhanced as well. Adopts newly designed epoxy-based flux that performs better for printability, longer printing lifetime and more reliability than typical epoxy-based solder pastes. Can reduce reflow temperature to below 190°C compared to lead-free soldering, typically 240°-250°C, and hence decrease PCB and substrate deformation while saving energy, reducing thermal stability requirement of PCBs and components, and raising yield rates. Is halogen-free (REL0) and complies with RoHS. RoHS 2.0 and REACH. Works with various surface finishes and has clear flux residue. Suitable for fine-pitch applications and various IC packages, such as system-in-package (SIP), wafer-level-package (WLP) and flip chip.

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