Loctite Ablestik ICP 2120 electrically conductive adhesive cures at room temperature, improving yield rates and protecting sensitive structures within mobile device compact camera modules (CCMs).

Is a moisture-cure ECA, designed to deliver robust electrical grounding performance. Distinctive chemistry provides low modulus (900 MPa @25°C) for drop performance, a curing profile for fast room- or low-temperature (50°C for 30 mins.) cure to enable high volume processing, substrate protection and reduced energy consumption. Electrical properties are optimized for performance. Has direct contact resistance of DCR @<5Ω/piece, as demonstrated on customer modules, and low volume resistance to ensure thorough removal of electrostatic discharge from the substrate for robust operation. Thermal conductivity is 7.0 W/m-K to dissipate operational heat to improve performance and reliability.

Henkel

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