Nihon Superior's LF-C2 Lead-Free Solder Paste delivers long life in thermal cycling but with a compliance that means that it is resistant to cracking under stress typical with automotive electronics.

Uses calibrated levels of the two key strengthening tools available in solder alloy formulation, stable dispersed particles combined with solid solution strengthening of the tin matrix. With a liquidus temperature of 213°C, can be reflowed at a lower temperature than SAC305 and has a higher shear strength than SAC305. Delivers excellent performance over a wide range of component types and process parameters.

Nihon Superior

www.nihonsuperior.co.jp