Henkel Rolls Out Loctite Ablestik ATB 125GR Die Attach Film
Henkel Loctite Ablestik ATB 125GR is a high-reliability nonconductive die attach film suitable for wirebond laminate and lead frame packages, compatible with small- to medium-sized die, and formulated to provide excellent workability and processability.
Offers controlled thickness and flow, no resin bleed, consistent fillet formation and bond line stability before and after cure, as well as high-reliability, Automotive Grade 0 performance for both laminate and lead frame designs, making it a good candidate for applications across consumer, automotive and industrial.
Features low modulus and low coefficient of thermal expansion (CTE) properties at room temperature, with a high modulus at wire bonding temperature to ensure high-reliability performance. Is said to demonstrate strong adhesion on Ag, Cu and PPF metal lead frames and laminate substrates, has low ionics to facilitate Cu wire bonding, and provides excellent processability and workability for all processing steps (lamination, dicing and die pick-up) on dies ranging in size from 0.5mm x 0.5mm to 3.0mm x 3.0mm. Available in 25µm thickness; custom thicknesses available on request.
Henkel
