Saki's 3Xi-M110 V3 model delivers cycle times more than twice as fast as previously possible and features upgraded accuracy ensuring cleaner results untarnished by shadows or noise.

Uses Planar CT technology to detect solder joint defects and microstructure abnormalities in high-density PCBs. Utilizes Real 3D volumetric inspection to clearly identify voids in multi-layer solder, THT assembly and BGA head-in-pillow issues, and defective component parts based on fillet position and other factors. Maintains the same weight and footprint as the original 3Xi-M110 while consuming 40% less power per board.

Saki Corporation

www.sakicorp.com