Shenmao's PF735-PQ10-10L is a low melting point lead-free solder paste that has been designed for the SMT process and is meant to increase production capacity in the high-speed printing process.

Can reduce the reflow temperature to below 190°C compared to lead-free soldering, which is typically 240°-250°C. When compared with SnAgCu, reduces peak reflow temperature, energy consumption, and warpage of PCBs and components. When compared to Sn42/Bi58 Eutectic alloy, is said to offer better ductility, finer microstructure, and increased drop and thermal reliability. Suitable for precise electronic products, such as laptops, PCs, servers and LED modules. Halogen-free and complies with RoHS, RoHS 2.0 and REACH.

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