Heraeus Electronics' Microbond SMT660 Innolot 2.0 no-clean printing T4 solder paste is a  high reliability, high performance solder paste that provides a competitive TCO offering.

Allows a wide process window, enabling soldering in air with a low defect rate, and is designed to offer an optimized formulation for lower costs. Offers reduced cost while maintaining higher creep resistance, resulting in longer product life cycles at higher operating temperatures. Also performs in the air without additional N₂ during reflow, while keeping defect rates low. Uses an acrylic based synthetic resin eliminating potential batch-to-batch variations when using natural raw materials, and due to its low impurities and the flux design, a high SIR performance is achieved, reducing the risk for electrochemical migration.

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