Shenmao's PF606-P130N is an anti-hop lead-free solder paste that is designed for the SMT process to prevent head-on-pillow (HoP) issues.

Is said to feature great flux activity that can prevent oxidation of solder powder during the reflow process, and shows excellent solderability and hot slump performance to cover the warpage of components and prevent BGA/CSP HoP issues.

Shenmao America

www.shenmao.com