Shenzhen Deepmaterial Technologies' latest range of advanced adhesive solutions includes its One Part Epoxy Adhesive, Two Part Epoxy Adhesive, and Magnet Bonding Adhesive.

One Part Epoxy Adhesive consists of a single component that is designed to cure and form a strong bond at room temperature or with the application of heat. Based on epoxy resin and is formulated with a curing agent or catalyst that remains dormant until it is exposed to specific conditions, such as air, moisture, or heat. Once activated, the curing agent initiates a chemical reaction, resulting in the cross-linking of polymer chains and the formation of a strong, durable bond.

Two Part Epoxy Adhesive consists of two separate components: a resin and a hardener, which are mixed together in a specific ratio just prior to use to initiate a chemical reaction, leading to the curing and hardening of the adhesive, causing it to cross-link and form a strong, durable bond.

Magnet Bonding Adhesive is used to bond magnets to a variety of surfaces, and features unique properties that allow for easy installation and strong hold.

Shenzhen Deepmaterial Technologies

www.electronicadhesive.com