MRSI Systems' MRSI-705HF high force die bonder is a new variant of the MRSI-705 platform.

Equipped with a heated bond head that can apply up to 500N of force during the bonding process, while providing heating up to 400°C from the top. Is said to be ideal for advanced applications such as sintering for power semiconductors and thermocompression bonding for IC packaging. Inherits the flexibility and robustness of the MRSI-705 platform, which can handle multiple die and process applications with auto-tool changing and laser soldering, eutectic with top and bottom heating, epoxy stamping, and dispensing in one machine.

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