Krylex's Kura-Low electronics adhesive enables high performance bonding performance at thermal cure temperatures as low as 60◦C, all while being supplied in a highly RT stabilised, one-part, pre-mixed formula.

Enables RT stability anywhere between three to five days, or up to six weeks depending on the product formula. Available in multiple curing formats: dual cure format, UV + Heat, for camera module, active alignment and lens bonding applications; thermal cure only system, for structural bonding applications e.g., OLED display, enclosure bonding, etc.; and snap cure, for applications demanding in-line processing.

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