Shenmao Launches Low-Temperature Ball Attachment Process Solutions
Shenmao's PF734-S is a low-temperature BGA solder sphere designed for low-temperature ball attachment processes.
Is built upon an improved low-temperature alloy PF734 and outperforms conventional low- temperature alloys like 42% Sn and 58% Bi. Features enhanced mechanical properties, ensuring exceptional product reliability even under rigorous testing conditions such as thermal cycling and thermal shock tests. Is complemented by low-temperature no-clean flux SMF-80 and water-soluble flux SMF-WC63.
SMF-80 eliminates the need for post-reflow cleaning while maintaining high reliability and insulation with minimal flux residue, and SMF-WC63 is said to offer outstanding cleanability, and any flux residue left after reflow can be easily cleaned with water. Both are halogen-free and fully comply with RoHS, RoHS 2.0, REACH, and other relevant environmental standards.
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